What is flip chip technology?

Flip chip technology is not new to the electronics business, and the uses are long-standing and far-reaching. IBM first developed these down-facing chips in the 1960’s, shortly after Delco Electronics adapted them for automotive production applications. Ten years later the uses expanded exponentially, and even today they are a fixture in the electronics manufacturing industry. Appropriately known as Controlled Collapse Chip Connection, the method uses bumps of solder on the face to make complete and dependable connections between the IC and the PCB. This technology has had a significant impact on the production and quality management processes that companies try to achieve. Engineers really thought this one through; the final product accomplishes a thorough electrical/thermal bond.

Exactly what is a flip chip, and how does it work?

Essentially, a flip chip is a typical semiconductor device that has been designed to incorporate solder bumps over the connection pads of the IC or microelectromechanical system (MEMS). This methodology creates a very thorough and reliable connection between the component and the board. The collapse aspect of the name refers to the heating of the solder bumps that results in a precise settling of the chip. Wire connections are widespread and cheap, but the quality of down-facing, flip chip technology is too great to ignore.

The role of flip chip technology

What makes the flip chip so unique is the direct, wireless application of the installation. The solid connectivity is much desired by buyers that need the component to function for their products for well beyond the terms of any warranty. The primary features of this technology are ease of production and quality management capabilities. With over 2000 bumps in some models, the flip chip method is simply more effective. This works to save a significant amount of time versus the one-wire-at-a-time method that was preferred before solder ball grid array, and then the consequential flip chip technology. The superior bonding that is achieved makes it great for products needed reliable, long-lasting components.

We are using technology from the 1960s?

As a matter of fact, we are using three of the major semiconductor advancements from the IBM and Delco labs of the 60s. The most popular option today is the flip chip technology, and there is no shortage of application in a large variety of the electronic devices that people enjoy. Electronic watches and beepers got their start thanks to flip chip technology, and many new cell phones and high-speed microprocessors are implementing the solid, dependable method. The use of flip chips is so great worldwide that they have become an integral part of electronic component design and assembly.

Flip chips should no longer be a mystery to you. They are semiconductors that are inverted and adorned in the fashion of a BGA. The chip is laid on the substrate and underfill is applied to act as a buffer in the spaces in between pad connections. As the solder is heated, the chip settles directly onto the pads of the board. Flip chip technology may be from the sixties, but that just testifies to fact that it has not needed much improvement.