At the heart of any computer or computation-enabled device are its processors and the chips that enable its functioning. The exponential growth in electronic and microelectronic devices and their capabilities has led to the use of microprocessors in the medical, military, industrial and consumer sectors. From a child’s robotic toy to a wireless communication device, integrated circuits (IC) form the core of the device’s functioning. A Ball Grid Array (BGA) helps connect a chip to the circuit board and is a type of surface mount technology. Essentially, a BGA is a series of tin-lead spheres placed on a circuit board. With the increase in levels of integration and an increasing number of pins, older technologies such as Quad Flat Package (QFP) configurations are being replaced by BGA packages that are less susceptible to damage, and less congested on circuit boards where space is at a premium.

A Ball Grid Array’s solder balls fit into smaller areas and therefore accommodate a higher density of input/output connections compared to older technologies. They also have shorter electrical paths that reduce overall inductance. BGA and circuit board repair and maintenance are an important auxiliary of the manufacturing process. The manufacture of BGA is governed under the IPC/EIA J-STD-032, ‘Performance Standard for Ball Grid Array Balls’, IPC-9701, the ‘Performance Test Methods and Quantification Requirements for Surface Mount Solder Attachments’ and IPC-7095A, for the ‘Design and Assembly Process Implementation for BGAs’. In recent times, there has been significant research into the improvement of the solder bumps and balls in Ball Grid Arrays. This research has benefited manufacturers as well as BGA and circuit board repair firms.

With the use of new materials and higher integration, Ball Grid Arrays used in high I/O devices allow for smaller packages, thereby reducing the overall size of devices while improving their reliability and performance.

The MJS Designs’ team repairs boards, from simple component removal to complex edits. Our experienced rework technicians have an extensive background in advanced packaging, which includes removal and replacement of CCGA’s, BGAs, uBGAs, CSPs, LGAs, QFNs, Interposers, Specialized Pin Adapters, Package on Package (PoP) and BGA type connectors. State of the art equipment, combined with our breadth of knowledge enables us to accommodate component pitches as small as 0.4mm to 1.27mm on components ranging from 4mm to 53mm with leaded or RoHS requirements. 3D X-Ray inspection assures that even the most complex or smallest of boards are checked for integrity.

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