Printed Circuit Board Assembly LANDING

(Excel format preferred)

PLEASE NOTE: Supplied BGAs must be compatible with the chosen process of leaded or lead free, or additional charges will apply. If you supply any BGA components, they must be compatible with the surface finish of the board and the solder utilized for the assembly process. Lead Free BGAs cannot utilize a HASL leaded board surface finish and a leaded assembly solder with 100% compatibility. Additional charges may apply for separate processing or BGA solder sphere removal/replacement. If Leaded BGAs are provided, and the process is to be Lead Free, additional charges may also apply for separate processing or BGA solder sphere removal/replacement.

PLEASE NOTE: If preferred process methodologies are not provided for cable or mechanical assembly during the quoting stage, MJS Designs will utilize our preferred method. If this is not approved during first articles or full builds, additional charges will be incurred for any changes.

(Excel format preferred)

PLEASE NOTE: Due to the nature of edits and repair work, board or component damage can occur. MJS Designs will take every precaution to minimize board or component damage. Additionally, there is a chance that the repair will not resolve the issue. MJS Designs will guarantee workmanship of the repair but not final functionality or damage that may occur during a rework process.

PLEASE NOTE: Due to the nature of edits and repair work, board or component damage can occur. MJS Designs will take every precaution to minimize board or component damage. Additionally, there is a chance that the repair will not resolve the issue. MJS Designs will guarantee workmanship of the repair but not final functionality or damage that may occur during a rework process.