Experienced Technicians
AND Excellent Workmanship

Circuit Board Repair and BGA Repair

100% 3D X-Ray affords you with the assurance of the highest
degree of quality workmanship.

The MJS Designs‘ team repairs boards, from simple component removal to complex edits. Our experienced rework technicians have an extensive background in advanced packaging, which includes removal and replacement of CCGA’s, BGAs, uBGAs, CSPs, LGAs, QFNs, Interposers, Specialized Pin Adapters, Package on Package (PoP) and BGA type connectors. State of the art equipment, combined with our breadth of knowledge enables us to accommodate component pitches as small as 0.4mm to 1.27mm on components ranging from 4mm to 53mm with leaded or RoHS requirements. 3D X-Ray inspection assures that even the most complex or smallest of boards are checked for integrity.

We accommodate advanced packaging assembly with component pitches as small as 0.2mm.

We repair lead free and leaded projects!

Removal/Replacement Capabilities:
Solder Sphere Attachment
Column Attachment
Custom Interposers
Lead and Lead Free Repair
BGAs, uBGAs, BGA Type Connectors
MicroBGA Placement at 0.2mm
4000+ I/O Ball Grid Arrays (BGA)
Package on Package (PoP)
Specialized Pin Adapters
3D X-ray Inspection
Side Prism Inspection Tools
Automated Component Removal Equipment
Custom Temperature Profiling
Board Repair
Wire Edits
Component Removal and Replacement