BGA and Board Repair

100% 3D X-Ray affords you with the assurance of the highest
degree of quality workmanship.

The MJS Designs' team repairs boards, from simple component removal to complex edits. Our experienced rework technicians have an extensive background in advanced packaging, which includes removal and replacement of CCGA’s, BGAs, uBGAs, CSPs, LGAs, QFNs, Interposers, Specialized Pin Adapters, Package on Package (PoP) and BGA type connectors. State of the art equipment, combined with our breadth of knowledge enables us to accommodate component pitches as small as 0.4mm to 1.27mm on components ranging from 4mm to 53mm with leaded or RoHS requirements. 3D X-Ray inspection assures that even the most complex or smallest of boards are checked for integrity.

 

We accommodate advanced packaging assembly with component pitches as small as 0.2mm.

  • Removal/Replacement Capabilities:
  • CCGAs, CSPs, QFNs, LGAs
  • Solder Sphere Attachment
  • Column Attachment
  • Custom Interposers
  • Lead and Lead Free Repair
  • BGAs, uBGAs, BGA Type Connectors
  • MicroBGA placement at 0.2mm
  • 4000+ I/O Ball Grid Arrays (BGA)
  • Package on Package (PoP)
  • Specialized Pin Adapters
  • 3D X-ray Inspection
  • Side Prism Inspection Tools
  • Automated Component Removal Equipment
  • Custom Temperature Profiling
  • Board Repair
  • Wire Edits
  • Component Removal and Replacement

We repair lead free and leaded projects!

Questions

 

MJS Designs, Inc.

4130 E. Wood Street, Suite 100
Phoenix, AZ 85040

Contact

Google Maps

Phone (602) 437-5068 Fax (602) 437-5299
(800) 445-9442
info@mjsdesigns.com

MJS on Facebook!