BGA and Board Repair

100% 3D X-Ray affords you with the assurance of the highest
degree of quality workmanship.

The MJS Designs’ team repairs boards, from simple component removal to complex edits. Our experienced rework technicians have an extensive background in advanced packaging, which includes removal and replacement of CCGA’s, BGAs, uBGAs, CSPs, LGAs, QFNs, Interposers, Specialized Pin Adapters, Package on Package (PoP) and BGA type connectors. State of the art equipment, combined with our breadth of knowledge enables us to accommodate component pitches as small as 0.4mm to 1.27mm on components ranging from 4mm to 53mm with leaded or RoHS requirements. 3D X-Ray inspection assures that even the most complex or smallest of boards are checked for integrity.

We accommodate advanced packaging assembly with component pitches as small as 0.2mm.

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We repair lead free and leaded projects!

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Testimonial

“I appreciate your help with this product.  The quality of the prototype parts is A1!  Great Job MJS!” 

Kevin K. 
Industrial Company